Subtitle Massively Parallel Post - Packaging for Microelectromechanical Systems ( Mems )
نویسندگان
چکیده
منابع مشابه
A Novel Approach For Hermetic Wafer Scale MEMS RF and GaAs Packaging
Technical advances in RF and GaAs devices have generally outpaced those in device packaging. This disparity has created a situation where packaging technology can become a limiter to device performance. A process strategy is presented here for massively parallel creation of hermetic wafer scale packaging for RF devices.
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This work addresses important post-packaging issues for microsystems and recommends specific research directions by localized heating and bonding. Micropackaging has become a major subject for both scientific research and industrial applications in the emerging filed of microelectromechanical systems (MEMS). Establishing a versatile post-packaging process not only advances the field but also sp...
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We have developed a new approach for performing high-bandwidth adaptive optics. Our approach is based on using massively parallel analog wavefront sensing, reconstruction, and compensation. We refer to our integrated adaptive optics system as a “silicon eye” because it operates in many ways analogous to biological retinas. In addition to speed, the silicon eye offers advantages in cost, size, a...
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This paper deals with some of the most important issues in modern packaging design and simulation of structures for use in wireless communications systems. The focus of the discussion is on the integration of novel complex device parameters, specifically the inclusion of MEMS devices and solid-state circuit elements, and on the mathematically correct implementation of the lossy material paramet...
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